Oscillator, electronic apparatus, and moving object

ABSTRACT

A temperature-compensated piezoelectric oscillator as an oscillator includes a piezoelectric resonator incorporating a resonator element, an electronic component (IC) as a circuit element having a function of driving the resonator element and a thermosensor, and a wiring board provided with a conductor film, and the piezoelectric resonator element and the electronic component (IC) are disposed side by side in an area where the conductor film is disposed.

BACKGROUND

1. Technical Field

The present invention relates to an oscillator, an electronic apparatusand a moving object each equipped with an oscillator.

2. Related Art

In recent years, an oscillator as an example of an electronic device isused in many fields from communication equipment such as a cellularphone to consumer equipment such as a quartz-crystal clock due to thefrequency stability, small size and light weight, robustness, low price,and so on. JP-A-2010-103802 (Document 1) discloses an oscillator whichhas achieved a surface-mount property. The oscillator of Document 1 iscomposed of a quartz crystal resonator, an electronic component (IC), apackage, and a lid member, wherein the quartz crystal resonatorincorporates a resonator element, the electronic component (IC) is acircuit element having a function of driving the resonator element, thepackage is a container having a recessed section, which has an openingin at least one direction, and houses the quartz crystal resonator andthe electronic component (IC), and the lid member having one surfaceopposed to the opening of the recessed section and connected to thepackage. Document 1 shows a structure in which the electronic component(IC) is mounted on an upper surface in a plan view of the quartz crystalresonator.

Incidentally, in the oscillator disclosed in Document 1, the electroniccomponent (IC) is mounted on the upper surface of the quartz crystalresonator in the plan view. In such a configuration, it results that theheat from the outside conducted from the outer bottom surface of thepackage is conducted to the quartz crystal resonator, and then conductedto the electronic component (IC) via the quartz crystal resonator.Therefore, in the case in which the external temperature varies, thetemperature of the quartz crystal resonator is varied by the externaltemperature variation, and then the temperature of the electroniccomponent (IC) is varied. Therefore, since a temperature differenceoccurs between the quartz crystal resonator and the electronic component(IC), in the case in which a thermosensor is incorporated in theelectronic component (IC), the temperature of the quartz crystalresonator is not correctly measured. Therefore, in the case ofcompensating the frequency of the oscillator based on the temperaturemeasured by the thermosensor, namely a temperature-compensatedoscillator, for example, there is a possibility that the frequencycompensation accuracy is deteriorated.

SUMMARY

An advantage of some aspects of the invention is to solve at least apart of the problems described above, and the invention can beimplemented as the following forms or application examples.

APPLICATION EXAMPLE 1

This application example is directed to an oscillator including aresonator element encapsulated in a first container, a circuit elementincluding a function of driving at least the resonator element, and athermosensor, and a wiring board provided with a conductor film, and thefirst container and the circuit element are disposed side by side in anarea where the conductor film is disposed in a plan view.

According to the oscillator described in this application example, thefirst container encapsulating the resonator element and the circuitelement are disposed in the area on the wiring board where the conductorfilm is disposed. Further, the first container and the circuit elementare disposed side by side on the wiring board in the plan view. Sincethe first container and the circuit element are disposed in such amanner, namely the first container and the circuit element are disposedside by side in the area of the wiring board where the conductor film isdisposed, the condition of the thermal conduction from the outside isequalized and at the same time the thermal coupling between the firstcontainer and the circuit element is enhanced, and even in the case inwhich the temperature varies in the outside of the wiring board, thetemperature of the resonator element encapsulated in the first containerand the temperature of the circuit element become roughly equal to eachother. Therefore, the temperature of the resonator element canaccurately be measured by the thermosensor existing inside the circuitelement. For example, since the temperature-compensated oscillatorperforms the compensation of the frequency based on the temperature ofthe resonator element, the more accurately the temperature of theresonator element can be measured, the higher compensation accuracy canbe obtained. Therefore, by using the present configuration, thetemperature-compensated oscillator having high temperature compensationaccuracy, for example, can be provided as the oscillator.

APPLICATION EXAMPLE 2

This application example is directed to the oscillator according toApplication Example 1, wherein the first container has at least onesurface formed of metal, and the one surface and the conductor film areopposed to each other.

According to this application example, since the surface formed of metalof the first container, namely the surface having electricalconductivity is opposed to the conductive film provided to the wiringboard, the thermal coupling between the first container and the circuitelement is enhanced, and it results that the state in which the firstcontainer and the circuit element are at the same temperature is furtherapproached. Therefore, it becomes possible to provide, for example, thetemperature-compensated oscillator with high temperature compensationaccuracy as the oscillator.

APPLICATION EXAMPLE 3

This application example is directed to the oscillator according toApplication Example 1, wherein the first container and the conductorfilm are bonded to each other via a bonding member having electricalconductivity.

According to this application example, the first container and theconductor film are bonded to each other with the bonding material havingelectrical conductivity. In general, since the higher the electricalconductivity is, the higher the thermal conductivity is, the thermalcoupling between the first container and the circuit element isenhanced, and it results that the state in which the first container andthe circuit element are at the same temperature is further approached.Therefore, it becomes possible to provide, for example, thetemperature-compensated oscillator with high temperature compensationaccuracy as the oscillator.

APPLICATION EXAMPLE 4

This application example is directed to the oscillator according toApplication Example 2, wherein the first container and the conductorfilm are bonded to each other via a bonding member having electricalconductivity.

According to this application example, the first container and theconductor film are bonded to each other with the bonding material havingelectrical conductivity. In general, since the higher the electricalconductivity is, the higher the thermal conductivity is, the thermalcoupling between the first container and the circuit element isenhanced, and it results that the state in which the first container andthe circuit element are at the same temperature is further approached.Therefore, it becomes possible to provide, for example, thetemperature-compensated oscillator with high temperature compensationaccuracy as the oscillator.

APPLICATION EXAMPLE 5

This application example is directed to the oscillator according toApplication Example 1, wherein the first container has an externalconnection terminal on a surface viewed from a direction of a surface ofthe wiring board on which the first container is disposed, the externalconnection terminal being electrically connected to the resonatorelement, the circuit element has a terminal electrode on a surfaceviewed from the direction of the surface of the wiring board on whichthe first container is disposed, and the connection terminal and theterminal electrode are electrically connected to each other.

According to this application example, since the electrical connectionterminal between the first container and the circuit element is disposedon the surface (the surface which can be viewed in the plan view, inother words, the upper surface) viewed from the surface of the wiringboard on which the first container is disposed, the thermal coupling andthe electrical connection between the first container and the circuitelement can separately be achieved. Therefore, since the arrangementwith the thermal coupling enhanced can be adopted irrespective of thestate of the electrical connection between the first container and thecircuit element, it becomes possible to provide, for example, thetemperature-compensated oscillator with high temperature compensationaccuracy as the oscillator.

APPLICATION EXAMPLE 6

This application example is directed to the oscillator according toApplication Example 2, wherein the first container has an externalconnection terminal on a surface viewed from a direction of a surface ofthe wiring board on which the first container is disposed, the externalconnection terminal being electrically connected to the resonatorelement, the circuit element has a terminal electrode on a surfaceviewed from the direction of the surface of the wiring board on whichthe first container is disposed, and the connection terminal and theterminal electrode are electrically connected to each other.

According to this application example, since the electrical connectionterminal between the first container and the circuit element is disposedon the surface (the surface which can be viewed in the plan view, inother words, the upper surface) viewed from the surface of the wiringboard on which the first container is disposed, the thermal coupling andthe electrical connection between the first container and the circuitelement can separately be achieved. Therefore, since the arrangementwith the thermal coupling enhanced can be adopted irrespective of thestate of the electrical connection between the first container and thecircuit element, it becomes possible to provide, for example, thetemperature-compensated oscillator with high temperature compensationaccuracy as the oscillator.

APPLICATION EXAMPLE 7

This application example is directed to the oscillator according toApplication Example 3, wherein the first container has an externalconnection terminal on a surface viewed from a direction of a surface ofthe wiring board on which the first container is disposed, the externalconnection terminal being electrically connected to the resonatorelement, the circuit element has a terminal electrode on a surfaceviewed from the direction of the surface of the wiring board on whichthe first container is disposed, and the connection terminal and theterminal electrode are electrically connected to each other.

According to this application example, since the electrical connectionterminal between the first container and the circuit element is disposedon the surface (the surface which can be viewed in the plan view, inother words, the upper surface) viewed from the surface of the wiringboard on which the first container is disposed, the thermal coupling andthe electrical connection between the first container and the circuitelement can separately be achieved. Therefore, since the arrangementwith the thermal coupling enhanced can be adopted irrespective of thestate of the electrical connection between the first container and thecircuit element, it becomes possible to provide, for example, thetemperature-compensated oscillator with high temperature compensationaccuracy as the oscillator.

APPLICATION EXAMPLE 8

This application example is directed to the oscillator according toApplication Example 4, wherein the first container has an externalconnection terminal on a surface viewed from a direction of a surface ofthe wiring board on which the first container is disposed, the externalconnection terminal being electrically connected to the resonatorelement, the circuit element has a terminal electrode on a surfaceviewed from the direction of the surface of the wiring board on whichthe first container is disposed, and the connection terminal and theterminal electrode are electrically connected to each other.

According to this application example, since the electrical connectionterminal between the first container and the circuit element is disposedon the surface (the surface which can be viewed in the plan view, inother words, the upper surface) viewed from the surface of the wiringboard on which the first container is disposed, the thermal coupling andthe electrical connection between the first container and the circuitelement can separately be achieved. Therefore, since the arrangementwith the thermal coupling enhanced can be adopted irrespective of thestate of the electrical connection between the first container and thecircuit element, it becomes possible to provide, for example, thetemperature-compensated oscillator with high temperature compensationaccuracy as the oscillator.

APPLICATION EXAMPLE 9

This application example is directed to an electronic apparatusincluding the oscillator according to Application Example 1.

According to the electronic apparatus described in this applicationexample, since the temperature-compensated oscillator with hightemperature compensation accuracy, for example, is used as theoscillator, it becomes possible to keep the accurate electricalcharacteristics also in the electronic apparatus.

APPLICATION EXAMPLE 10

This application example is directed to an electronic apparatusincluding the oscillator according to Application Example 2.

According to the electronic apparatus described in this applicationexample, since the temperature-compensated oscillator with hightemperature compensation accuracy, for example, is used as theoscillator, it becomes possible to keep the accurate electricalcharacteristics also in the electronic apparatus.

APPLICATION EXAMPLE 11

This application example is directed to an electronic apparatusincluding the oscillator according to Application Example 3.

According to the electronic apparatus described in this applicationexample, since the temperature-compensated oscillator with hightemperature compensation accuracy, for example, is used as theoscillator, it becomes possible to keep the accurate electricalcharacteristics also in the electronic apparatus.

APPLICATION EXAMPLE 12

This application example is directed to a moving object including theoscillator according to Application Example 1.

According to the moving object described in this application example,since the temperature-compensated oscillator with high temperaturecompensation accuracy, for example, is used as the oscillator, itbecomes possible to keep the accurate electrical characteristics also inthe moving object.

APPLICATION EXAMPLE 13

This application example is directed to a moving object including theoscillator according to Application Example 2.

According to the moving object described in this application example,since the temperature-compensated oscillator with high temperaturecompensation accuracy, for example, is used as the oscillator, itbecomes possible to keep the accurate electrical characteristics also inthe moving object.

APPLICATION EXAMPLE 14

This application example is directed to a moving object including theoscillator according to Application Example 3.

According to the moving object described in this application example,since the temperature-compensated oscillator with high temperaturecompensation accuracy, for example, is used as the oscillator, itbecomes possible to keep the accurate electrical characteristics also inthe moving object.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention will be described with reference to the accompanyingdrawings, wherein like numbers reference like elements.

FIGS. 1A and 1B are schematic diagrams showing a structure of apiezoelectric oscillator according to a first embodiment of theinvention, wherein FIG. 1A is a plan view, and FIG. 1B is across-sectional view along the arrows Q-Q′.

FIGS. 2A and 2B are schematic diagrams showing an external configurationof the piezoelectric oscillator according to the embodiment, whereinFIG. 2A is a front view, and FIG. 2B is a bottom view.

FIG. 3 is a cross-sectional view of a laminated green sheet before beingdivided into packages.

FIG. 4 is a process procedure chart of the piezoelectric oscillatoraccording to the first embodiment.

FIG. 5 is a perspective view showing a configuration of a mobilepersonal computer as an example of the electronic apparatus.

FIG. 6 is a perspective view showing a configuration of a cellular phoneas an example of the electronic apparatus.

FIG. 7 is a perspective view showing a configuration of a digital stillcamera as an example of the electronic apparatus.

FIG. 8 is a perspective view showing a configuration of a vehicle as anexample of the moving object.

DESCRIPTION OF EXEMPLARY EMBODIMENTS

Some embodiments of the invention will hereinafter be explained indetail with reference to the accompanying drawings.

FIGS. 1A and 1B are schematic diagrams showing an internal configurationof a piezoelectric oscillator according to an embodiment of theinvention, wherein FIG. 1A is a plan view, and FIG. 1B is across-sectional view along the arrows Q-Q′ shown in FIG. 1A. Further,FIGS. 2A and 2B are schematic diagrams showing an external configurationof the piezoelectric oscillator according to the present embodiment,wherein FIG. 2A is a front view, and FIG. 2B is a bottom view.

A temperature-compensated piezoelectric oscillator 1 as an example ofthe piezoelectric oscillator according to the present embodiment isprovided with a laminated ceramic package (hereinafter simply referredto as a “package”) 10 formed by stacking ceramics as an airtightcontainer, which is a second container. The package 10 is composed of asubstrate (a wiring board) 11, a first frame-shaped side wall 13, and asecond frame-shaped side wall 15, wherein the first frame-shaped sidewall 13 is bonded on the substrate 11, and the second frame-shaped sidewall 15 is bonded on the first frame-shaped side wall 13. A seal ring 18made of metal (kovar material) is bonded to an upper surface 15 b of thesecond frame-shaped side wall 15.

The substrate 11 is composed of a lower surface 11 a as a firstprincipal surface, an upper surface 11 b as a second principal surface,and a plate-like ceramic having a side surface 11 c continuous with thelower surface 11 a and the upper surface 11 b. The side surface 11 c ofthe substrate 11 is provided with castellations (first notches) 12 eachextending from the lower surface 11 a to the upper surface 11 b.

The first frame-shaped side wall 13 is composed of a lower surface 13 aand a side surface 13 c continuous with an upper surface 13 b, and isdisposed on the substrate 11. The side surface 13 c of the firstframe-shaped side wall 13 is provided with castellations (first notches)14 each extending from the lower surface 13 a to the upper surface 13 b.

The second frame-shaped side wall 15 is also composed of a lower surface15 a and a side surface 15 c continuous with the upper surface 15 b, andis disposed on the first frame-shaped side wall 13. The side surface 15c of the second frame-shaped side wall 15 is provided with castellations(second notches) 16 each extending from the lower surface 15 a to theupper surface 15 b.

In the inside (space), which is the recessed section having the openingin one direction of the package 10, there are housed a piezoelectricresonator 20 formed by packaging the resonator element (not shown) and avariety of electronic components 25, 26, and the piezoelectric resonator20 and the variety of electronic components 25, 26 constitute, forexample, a temperature-compensated piezoelectric oscillator. Thepiezoelectric resonator 20 and the electronic component 25 are disposedin the recessed section side by side in a plan view (viewed from theopening side).

The piezoelectric resonator 20 is obtained by housing the piezoelectricresonator element (a resonator element) not shown in a recessed sectionof a package made of ceramic having a concave shape as a firstcontainer, then filling the inside of the recessed section with an inertgas (N₂), then covering the recessed section with a lid member made ofmetal not shown such as a kovar material, and then airtightly sealingthe lid member, and is mounted on a conductive film 32 existing in therecessed section of the package 10 via an electrically-conductiveadhesive 33 with the metal lid member side opposed to the conductivefilm 32. It should be noted that the inside of the piezoelectricresonator 20 can also be filled with another inert gas, or can also beset to a vacuum state.

Further, external connection terminals 21 a, 21 b are formed on theupper surface of the package of the piezoelectric resonator 20. Itshould be noted that the upper surface of the package of thepiezoelectric resonator 20 denotes a surface on the side, which can bevisually recognized when viewing the piezoelectric resonator 20 mountedon the package 10 from the direction of a lid member 40 of the package10. In other words, the upper surface of the package of thepiezoelectric resonator 20 is a surface on an opposite side to the sideto which the lid member covering the recessed section of the package ofthe piezoelectric resonator 20 is connected.

The electronic component 26 is, for example, a chip capacitor or thelike, and is mounted on a wiring conductor 31 in the package 10 via, forexample, solder.

The electronic component 25 as a circuit element is an IC incorporating,for example, an oscillator circuit, a temperature sensor as athermosensor, a variable capacitance element, and a temperaturecompensation circuit. Further, the electronic component 25 is mounted onthe conductive film 32 via an electrically-conductive adhesive 33 in astate of being arranged side by side with the piezoelectric resonator20, wherein the conductive film 32 exists in the recessed section of thepackage 10.

In an upper surface peripheral portion of the electronic component 25,there are formed a plurality of terminal electrodes 25 a, 25 a, . . . ,and one of the terminal electrodes 25 a is connected to the externalconnection terminal 21 a with a bonding wire 34, and another of theterminal electrodes 25 a is connected to the external connectionterminal 21 b with another bonding wire 34. Further, the rest of theterminal electrodes 25 a are connected to pad electrodes 30 with bondingwires 34, respectively, the pad electrodes 30 being formed in a steppedportion of the package 10, namely on the upper surface 13 b of the firstframe-shaped side wall 13. It should be noted that the upper surface ofthe electronic component 25 denotes a surface on the side, which canvisually be viewed from the direction of the lid member 40.

The pad electrodes 30 are electrically connected to terminal electrodesVSS, VCO, CONT, OUT, and so on disposed on a bottom surface of thepackage 10 shown in FIG. 2B via the wiring conductors 31, internalconductors not shown, and the castellations 12, 14, respectively.

The lid member 40 made of metal (the kovar material) not shown is seamwelded to the seal ring 18 formed on the upper surface of the package10. On this occasion, an inert gas (a nitrogen gas N₂) is encapsulatedinside the package 10 so as to suppress the aging of the electroniccomponents 25, 26, wiring conductors, the terminal electrodes, and soon. It should be noted that the inside of the package 10 can also befilled with another inert gas, or can also be set to a vacuum state.

In the temperature-compensated piezoelectric oscillator 1 configured asdescribed above, it is configured so as to be durable against long termuse of, for example, 10 through 20 years by being equipped with thepiezoelectric resonator 20 having the piezoelectric resonator elementpackaged (airtightly sealed) in the space of the package 10 forachieving the airtight sealing in an inert gas atmosphere or in avacuum.

Further, in the temperature-compensated piezoelectric oscillator 1according to the present embodiment, in order to ensure the internalspace (the recessed section having the opening on the side where the lidmember 40 is disposed) of the package 10 without increasing the size ofthe temperature-compensated piezoelectric oscillator 1, the depth (theradius if a semicylindrical shape is adopted) of the castellations 12,14 provided to the substrate 11 and the first frame-shaped side wall 13and the depth of the castellations 16 provided to the secondframe-shaped side wall 15 are made different from each other as shown inthe side view of FIG. 2A. Specifically, in the present embodiment, bymaking the depth of the castellations 16 of the second frame-shaped sidewall 15 having the smallest wall thickness shallower than that of thecastellations 12, 14 provided to the substrate 11 and the firstframe-shaped side wall 13, it is arranged that the internal space (theinternal capacity) of the package 10 is increased while keeping thesecond frame-shaped side wall 15 with the wall thickness having thesufficient strength. Thus, it becomes possible to install thepiezoelectric resonator 20 thus packaged in the package 10 withoutgrowing the package 10 of the temperature-compensated piezoelectricoscillator 1 in size. In other words, it becomes possible to realize thetemperature-compensated piezoelectric oscillator 1, which is small insize, and is capable of maintaining the electrical characteristics for along period of time.

FIG. 3 is a cross-sectional diagram showing a process of forming thelaminated sheet for the package of the piezoelectric oscillatoraccording to the present embodiment. In this case, a green sheet G2(which forms the first frame-shaped side wall 13) is stacked on a greensheet G1 (which forms the substrate 11), then a green sheet G3 (whichforms the second frame-shaped side wall 15) is further stacked thereon,and then calcination is performed thereon, wherein the green sheet G1 isprovided with a plurality of holes 12′ each having a predetermined size,the green sheet G2 is provided with a plurality of holes 14′ each havinga predetermined size and an opening section OP1, and the green sheet G3is provided with a plurality of holes 16′ each having a predeterminedsize and an opening section OP2. On this occasion, the holes 12′ of thegreen sheet G1 and the holes 14′ of the green sheet G2 are arranged topenetrate the respective green sheets in a state in which a conductivematerial is applied to the inner wall surfaces 12 a, 14 a thereof. Sucha structure can be formed by filling the holes 12′, 14′ of the greensheets G1, G2 with the conductive material, and then sucking theconductive material in the holes 12′, 14′.

Then, by circulating a coating liquid through the holes 12′, 14′, and16′, it is possible to perform coating on the conductive material on thedesired inner surfaces 12 a, 14 a, and 16 a.

Therefore, by subsequently dividing the green sheets G1, G2, and G3stacked on each other at the lines B-B, the ceramic packages 10 providedwith the castellations 12, 14, and 16 can be obtained. As an example, inthe case in which the hole 12′ has a cylindrical shape, the diameterthereof is 0.15 mm, and the diameter of the hole 16′ is in a range from0.08 mm to 0.1 mm.

As described above, by appropriately selecting the sizes of the holes12′, 14′, and 16′, it is possible to set the depths of the castellations12, 14, and 16 to desired values.

Further, it is also possible to provide the coating of the castellations16 to a predetermined position (height), and there is also an advantagethat the short circuit between the lid member 40 and the castellations16 can be prevented in the case of seam welding the lid member 40 to theseal ring 18 of the package 10.

Further, as the shape of the holes 12′, 14′ and 16′, although thecylindrical shape is adopted commonly, an elliptical shape or arectangular shape can also be adopted.

In the present embodiment, since the sizes of the holes 12′, 14′ aremade equal to each other, and the size of the holes 16′ is made smallerthan the sizes of the holes 12′, 14′, the castellations 12, 14 are equalin depth to each other, and the depth of the castellations 16 becomesshallower than the depth of the castellations 12, 14 in this case.Further, in the case of setting the sizes of the holes 14′, 16′ to beequal to each other, and smaller than the size of the hole 12′, itbecomes that the castellations 14, 16 are equal in depth to each other,and shallower in depth than the castellations 12.

In either of the cases, it is important that the depth of thecastellations 12 is set to be roughly equal to the depth in the relatedart package to thereby keep the level with which the bonding strengthwith the mounting board can be maintained. Further, it is important forthe depth of the castellations 16, or the depth of the castellations 14,16 to be kept at a level with which the strength of the package 10 canbe maintained in roughly the same level as in the related art.

It should be noted that although in the present embodiment theexplanation is presented citing as an example the case in which thenumber of green sheets to be stacked on each other is three, the numberis not required to be limited to three, but can be a number suitable forthe desired package.

As described above, in the present embodiment, since the depth of thecastellations 12 of the side surface 11 c of the substrate 11, or thedepth of the castellations 12 of the side surface 11 c of the substrate11 and the castellations 14 of the side surface 13 c of the firstframe-shaped side wall 13 can be made deeper, the bonding strength withthe mounting board can be maintained.

Further, in the embodiment, since depth of the castellations 16 of theside surface 15 c of the second frame-shaped side wall 15 can be madeshallower than that of the castellations 12, 14, it is possible tominiaturize the temperature-compensated piezoelectric oscillator 1 whileensuring the strength of the package 10.

In the present embodiment, the piezoelectric resonator 20 and theelectronic component 25 are arranged on the conductor film 32 existingin the recessed section of the package 10 side by side in the plan view,and are mounted via the electrically-conductive adhesive 33. Therefore,the condition of the heat conduction from the outside of the package 10is equalized, and at the same time, the thermal coupling between thepiezoelectric resonator 20 and the electronic component 25 is enhancedvia the conductor film 32 and the electrically-conductive adhesive 33.In addition, since the piezoelectric resonator 20 is mounted on thepackage 10 via the electrically-conductive adhesive 33 with the metallid member not shown of the piezoelectric resonator 20 and the conductorfilm 32 opposed to each other, the thermal coupling between thepiezoelectric resonator 20 and the electronic component 25 is furtherenhanced. Therefore, the temperature measured by the temperature sensorincorporated in the electronic component 25 becomes roughly equal to thetemperature of the piezoelectric resonator 20. Therefore, it becomespossible to perform accurate measurement of the piezoelectric resonator20, and to improve the temperature compensation accuracy of thetemperature-compensated piezoelectric oscillator 1.

Further, by configuring the electronic device having the space of thepackage 10 encapsulating the inert gas therein and then airtightlysealed with the lid member 40, there is an advantage that the aging ofthe electronic components, the connection conductors, the electrodeterminals, and so on housed in the laminated ceramic package isimproved, and thus the electronic device durable against long term useof 10 through 20 years can be configured.

Then, a method of manufacturing the temperature-compensatedpiezoelectric oscillator according to the first embodiment will beexplained with reference to FIGS. 4, 1A, and 1B.

Firstly, the package 10 made of laminated ceramic and provided with thepad electrodes 30, the wiring conductors 31, the conductor film 32, thecastellations 12, 14, and 16, and so on is prepared.

Firstly, as a first step, solder is applied on the wiring conductor 31for the capacitor of the package 10 shown in FIGS. 1A and 1B using adispenser.

Then, as a second step, the capacitor (the chip capacitor) 26 is mountedon the solder using a mounting device, and is then fed through a reflowdevice having a predetermined temperature distribution to thereby fixthe chip capacitor 26 with the solder.

Subsequently, as a third step, the electrically-conductive adhesive 33is applied to the conductor film 32 for mounting the piezoelectricresonator 20 and the electronic component 25 using a dispenser or thelike.

Then, as a fourth step, the piezoelectric resonator and the electroniccomponent 25 are mounted on the electrically-conductive adhesive 33, andthen the electrically-conductive adhesive 33 is dried to cure at apredetermined temperature (e.g., 150° C. for 0.5 H).

Subsequently, as a fifth step, the external connection terminals 21 a,21 b of the piezoelectric resonator 20 and the terminal electrodes 25 aon the IC 25 are connected to each other with the bonding wires 34,respectively. Further, the predetermined terminal electrodes 25 a on theIC 25 and the pad electrodes 30 of the package 10 are connected to eachother with the bonding wires 34, respectively.

Then, as a sixth step, the lid member 40 made of metal is welded to theseal ring 18 of the package 10 using a seam welder (a LID seal). Afterthe welding process, the airtightness is checked.

Subsequently, as a seventh step, a predetermined display is carved onthe lid member 40 with a laser. The piezoelectric oscillator accordingto the embodiment of the invention is completed through the processdescribed above.

By adopting such a method of manufacturing the piezoelectric oscillatoras described above, it becomes possible to manufacture thetemperature-compensated piezoelectric oscillator 1 small in size, andhaving the electrical characteristics durable for 10 through 20 years.

Although in the above description, the explanation is presented citingthe temperature-compensated oscillator using the piezoelectric resonatorelement as the resonator element as an example, the invention is notlimited to the example, but the resonator element can also be anelectromechanical resonator such as an MEMS resonator. Further, as thepiezoelectric resonator element, any resonator element using apiezoelectric material such as a quartz crystal resonator, an SAWresonator, or a piezoelectric thin film resonator can sufficiently beadopted.

Electronic Apparatus

Then, the electronic apparatuses to which the temperature-compensatedpiezoelectric oscillator 1 as the temperature-compensated oscillatoraccording to the embodiment of the invention will be explained in detailwith reference to FIGS. 5 through 7. It should be noted that in theexplanation, an example of applying the temperature-compensatedpiezoelectric oscillator 1 is described.

FIG. 5 is a perspective view showing a schematic configuration of amobile type (or a laptop type) personal computer as the electronicapparatus equipped with the temperature-compensated piezoelectricoscillator 1 according to the embodiment of the invention. In thedrawing, the personal computer 1100 includes a main body section 1104provided with a keyboard 1102, and a display unit 1106 provided with adisplay section 100, and the display unit 1106 is pivotally supportedwith respect to the main body section 1104 via a hinge structure. Such apersonal computer 1100 incorporates the temperature-compensatedpiezoelectric oscillator 1 as a reference signal source or the like.

FIG. 6 is a perspective view showing a schematic configuration of acellular phone (including PHS) as the electronic apparatus equipped withthe temperature-compensated piezoelectric oscillator 1 according to theembodiment of the invention. In this drawing, the cellular phone 1200 isprovided with a plurality of operation buttons 1202, an ear piece 1204,and a mouthpiece 1206, and a display section 100 is disposed between theoperation buttons 1202 and the ear piece 1204. Such a cellular phone1200 incorporates the temperature-compensated piezoelectric oscillator 1as a reference signal source or the like.

FIG. 7 is a perspective view showing a schematic configuration of adigital still camera as the electronic apparatus equipped with thetemperature-compensated piezoelectric oscillator 1 according to theembodiment of the invention. It should be noted that the connection withexternal equipment is also shown briefly in this drawing. Here,conventional cameras expose a silver salt film to an optical image of anobject, while the digital still camera 1300 performs photoelectricconversion on an optical image of an object by an imaging element suchas a CCD (a charge coupled device) to generate an imaging signal (animage signal).

A case (a body) 1302 of the digital still camera 1300 is provided with adisplay section 100 disposed on the back surface thereof to have aconfiguration of performing display in accordance with the imagingsignal from the CCD, wherein the display section 100 functions as aviewfinder for displaying the object as an electronic image. Further,the front surface (the back side in the drawing) of the case 1302 isprovided with a light receiving unit 1304 including an optical lens (animaging optical system), the CCD, and so on.

When the photographer checks an object image displayed on the displaysection 100, and then holds down a shutter button 1306, the imagingsignal from the CCD at that moment is transferred to and stored in thememory device 1308. Further, the digital still camera 1300 is providedwith video signal output terminals 1312 and an input-output terminal1314 for data communication disposed on a side surface of the case 1302.Further, as shown in the drawing, a television monitor 1430 and apersonal computer 1440 are respectively connected to the video signaloutput terminals 1312 and the input-output terminal 1314 for datacommunication according to needs. Further, there is adopted theconfiguration in which the imaging signal stored in the memory device1308 is output to the television monitor 1430 and the personal computer1440 in accordance with a predetermined operation. Such a digital stillcamera 1300 incorporates the temperature-compensated piezoelectricoscillator 1 as a reference signal source or the like.

It should be noted that, the temperature-compensated piezoelectricoscillator 1 according to the embodiment of the invention can also beapplied to an electronic apparatus such as an inkjet ejection device(e.g., an inkjet printer), a laptop personal computer, a television set,a video camera, a video recorder, a car navigation system, a pager, apersonal digital assistance (including one with a communicationfunction), an electronic dictionary, an electric calculator, acomputerized game machine, a word processor, a workstation, a videophone, a security video monitor, a pair of electronic binoculars, a POSterminal, a medical device (e.g., an electronic thermometer, anelectronic manometer, an electronic blood sugar meter, anelectrocardiogram measurement instrument, an ultrasonograph, and anelectronic endoscope), a fish detector, various types of measurementinstruments, various types of gauges (e.g., gauges for a vehicle, anaircraft, or a ship), and a flight simulator besides the personalcomputer (the mobile personal computer) shown in FIG. 5, the cellularphone shown in FIG. 6, and the digital still camera shown in FIG. 7.

Moving Object

FIG. 8 is a perspective view schematically showing a vehicle as anexample of the moving object. The vehicle 106 is equipped with thetemperature-compensated piezoelectric oscillator 1 according to theembodiment of the invention. For example, as shown in the drawing, inthe vehicle 106 as the moving object, an electronic control unit 108incorporating the temperature-compensated piezoelectric oscillator 1 andfor controlling tires 109 and so on is installed in a vehicle body 107.

The entire disclosure of Japanese Patent Application No. 2012-262120,filed Nov. 30, 2012 is expressly incorporated by reference herein.

What is claimed is:
 1. An oscillator comprising: a resonator element; acircuit element including a function of driving at least the resonatorelement, and a thermosensor; a wiring board provided with a conductorfilm; and a first container having the resonator element mountedtherein, wherein, when viewing a surface of the wiring board on whichthe first container is disposed, the first container has an externalconnection terminal on a surface thereof, and the external connectionterminal is electrically connected to the resonator element, whenviewing the surface of the wiring board on which the first container isdisposed, the circuit element has a terminal electrode on a surfacethereof, and the external connection terminal and the terminal electrodeare electrically connected to each other, and the resonator element andthe circuit element are disposed side by side in a non-overlappingmanner in an area where the conductor film is disposed in a plan view.2. The oscillator according to claim 1, further comprising a firstcontainer having the resonator element mounted therein, the firstcontainer having at least one surface formed of metal, and the onesurface and the conductor film are opposed to each other.
 3. Theoscillator according to claim 1, further comprising a first containerhaving the resonator element mounted therein, wherein the firstcontainer and the conductor film are bonded to each other via a bondingmember having electrical conductivity.
 4. The oscillator according toclaim 2, wherein the first container and the conductor film are bondedto each other via a bonding member having electrical conductivity.
 5. Anelectronic apparatus comprising: the oscillator according to claim
 1. 6.An electronic apparatus comprising: the oscillator according to claim 2.7. An electronic apparatus comprising: the oscillator according to claim3.
 8. A moving object comprising: the oscillator according to claim 1.9. A moving object comprising: the oscillator according to claim
 2. 10.A moving object comprising: the oscillator according to claim
 3. 11. Theoscillator according to claim 1, wherein the external connectionterminal and the terminal electrode are electrically connected to eachother via a wire that is separate and apart from the conductor film. 12.The oscillator according to claim 1, wherein the resonator element andthe circuit element are disposed side by side in the non-overlappingmanner in the area where the conductor film is disposed in the plan viewsuch that an entirety of the each of the resonator element and thecircuit element are overlapped by the conductor film.